Low-temperature direct copper-to-copper bonding enabled by creep on highly (1 1 1)-oriented Cu surfaces

Scripta Materialia

Volumn 78-79, Issue , 2014, Pages 65-68

  Liu, Chien Min ^a   Lin, Han Wen ^a   Chu, Yi Cheng ^a   Chen, Chih ^a   Lyu, Dian Rong ^a   Chen, Kuan Neng ^a   Tu, K N ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Creep; Cu to Cu direct bonding; Diffusion; Preferred orientation

Indexed keywords

BONDING PROCESS; BONDING TEMPERATURES; DIRECT BONDING; LOW TEMPERATURES; PB FREE SOLDERS; PREFERRED ORIENTATIONS; REFLOW TEMPERATURES; SURFACE DIFFUSIVITY;

CREEP; DIFFUSION; LEAD; SURFACE DIFFUSION; TEMPERATURE;

COPPER;

EID: 84900597650     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2014.01.040     Document Type: Article

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