Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints

Scripta Materialia

Volumn 69, Issue 1, 2013, Pages 25-28

  Liang, Y C ^a   Lin, H W ^a   Chen, H P ^b   Chen, C ^a   Tu, K N ^b   Lai, Y S ^c  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Diffusion; SnPb composite solder joint; Stress migration; Temperature cycling test

Indexed keywords

ANISOTROPIC GRAIN GROWTH; ATOMIC MIGRATION; COMPOSITE SOLDER JOINTS; CYCLIC TEMPERATURES; EUTECTIC MICROSTRUCTURE; EUTECTIC STRUCTURES; STRESS MIGRATION; TEMPERATURE CYCLING TESTS;

ANISOTROPY; CRACKS; DIFFUSION; EUTECTICS; GRAIN GROWTH;

TIN;

EID: 84876922515     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2013.03.018     Document Type: Article

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