Reliability challenges in 3D IC packaging technology

Microelectronics Reliability

Volumn 51, Issue 3, 2011, Pages 517-523

  Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRITICAL ELEMENTS; FLIP CHIP TECHNOLOGIES; IC PACKAGING; MICRO-BUMPS; MICROELECTRONIC INDUSTRY; RELIABILITY PROBLEMS; STRESS-MIGRATION; TEMPERATURE GRADIENT; THERMOMIGRATION;

MICROELECTRONICS; THERMAL GRADIENTS; THREE DIMENSIONAL;

RELIABILITY;

EID: 79951951987     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.09.031     Document Type: Article

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