Nanoscale silver sintering for high-temperature packaging of semiconductor devices

MPMD Fifth Global Innovations Proceedings, Surfaces and Interfaces in Nanostructured Materials and Trends in LIGA, Miniaturization, and Nanoscale Materials

Volumn , Issue , 2004, Pages 129-135

  Zhang, Zhiye ^a   Calata, Jesus Noel ^a   Bai, John G ^a   Lu, Guo Quan ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

High temperature packaging; Nanoparticles; Silver; Sintering

Indexed keywords

BONDING; BRITTLENESS; COSTS; DENSIFICATION; HEATING; HIGH TEMPERATURE EFFECTS; NANOSTRUCTURED MATERIALS; PACKAGING; PALLADIUM; SILVER; SINTERING; SOLDERING ALLOYS; VAPORIZATION;

HIGH-TEMPERATURE PACKAGING; NANOPARTICLES; REMOTE ACTUATORS; SCANNING ACOUSTIC MICROSCOPY (SAM);

SEMICONDUCTOR DEVICES;

EID: 3042700249     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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