Power cycling at high temperature swings of modules with low temperature joining technique

Proceedings of the International Symposium on Power Semiconductor Devices and ICs

Volumn 2006, Issue , 2006, Pages

  Amro, R ^a   Lutz, J ^a   Rudzki, J ^b   Sittig, R ^c   Thoben, M ^d  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^b UNIVERSITY OF APPLIED SCIENCES   (Germany)

^c TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

^d INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; HIGH TEMPERATURE APPLICATIONS; INTERCONNECTION NETWORKS; SEMICONDUCTOR JUNCTIONS; SOLDERED JOINTS;

INTERCONNECTION TECHNOLOGIES; JUNCTION TEMPERATURE; LOW TEMPERATURE JOINING; POWER CYCLING;

POWER ELECTRONICS;

EID: 34247540941     PISSN: 10636854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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3. C.Mertens: Die Niedertemperatur-Verbindungstechnik der Leistungselektronik, PhD thesis, VDI Verlag, Nr. 365, Düsseldorf 2004
4. th annual IEEE power electronics specialists conference, pp. 4178-4182, Aachen, Germany 2004
5. U. Scheuermann; U. Hecht: Power Cycling Life-time of Advanced Power Modules for different Temperature Swings; Proc. of PCIM 2002, pp. 59-64, Nuremberg
6. J. Schulz-Hard, A. Utz-Kistner: Advantages and New Development of DBC substrates. Advancing Microelectronics 11/12 2005
7. T. Schütze; H. Berg; M. Hierholzer: Further improvements in the reliability of IGBT Modules. IEEE industry applications conference 1998, Vol.2, pp. 1022-1025.