On-chip thermal management and hot-spot remediation

Nano-Bio- Electronic, Photonic and MEMS Packaging

Volumn , Issue , 2010, Pages 349-429

  Bar Cohen, Avram ^a   Wang, Peng ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Electronic cooling; Hot spots; Microcoolers; Nanoelectronics; Thermal interface materials (TIM); Thermal management; Thermoelectric coolers

Indexed keywords

EID: 84890187688     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4419-0040-1_12     Document Type: Chapter

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