-
2
-
-
0022122955
-
A test device for measuring thermal impedance of heat transfer interface materials
-
M. de Sorgo, "A test device for measuring thermal impedance of heat transfer interface materials," Power Conv. Intell. Motion, vol. 11, pp. 59-62, 1985.
-
(1985)
Power Conv. Intell. Motion
, vol.11
, pp. 59-62
-
-
de Sorgo, M.1
-
3
-
-
0029457242
-
Thermal performance of interface material in microelectronics packaging applications
-
San Diego, CA
-
M. Early, S. Lee, and M. Pellilo, "Thermal performance of interface material in microelectronics packaging applications," in Proc. IEPS'95 Conf., San Diego, CA, 1995, pp. 534-544.
-
(1995)
Proc. IEPS'95 Conf.
, pp. 534-544
-
-
Early, M.1
Lee, S.2
Pellilo, M.3
-
4
-
-
0026066083
-
Reducing the thermal resistance of a pressed contact by employing an interfacial filler
-
R. F. Babus'Haq, P. W. O'Callaghan, and S. D. Probert, "Reducing the thermal resistance of a pressed contact by employing an interfacial filler," Heat Transfer Eng., vol. 12, pp. 28-36, 1991.
-
(1991)
Heat Transfer Eng.
, vol.12
, pp. 28-36
-
-
Babus'Haq, R.F.1
O'Callaghan, P.W.2
Probert, S.D.3
-
6
-
-
0007264901
-
Percolation theory applied to study the effect of shape and size of the filler particles in thermal interface materials
-
A. Devpura, P. E. Phelan, and R. S. Prasher, "Percolation theory applied to study the effect of shape and size of the filler particles in thermal interface materials," in Proc. ASME Heat Transfer Division, vol. 4, 2000, pp. 365-371.
-
(2000)
Proc. ASME Heat Transfer Division
, vol.4
, pp. 365-371
-
-
Devpura, A.1
Phelan, P.E.2
Prasher, R.S.3
-
7
-
-
0033694254
-
Percolation theory applied to the analysis of thermal interface materials in flip-chip technology
-
A. Devpura, P. E. Phelan, and R. S. Prasher, "Percolation theory applied to the analysis of thermal interface materials in flip-chip technology," in Proc. ITHERM, vol. 1, 2000, pp. 21-28.
-
(2000)
Proc. ITHERM
, vol.1
, pp. 21-28
-
-
Devpura, A.1
Phelan, P.E.2
Prasher, R.S.3
-
8
-
-
0033678411
-
Thermal modeling and experimental validation of thermal interface performance between nonflat surfaces
-
C. P. Chiu, G. L. Solbrekken, and T. M. Young, "Thermal modeling and experimental validation of thermal interface performance between nonflat surfaces," in Proc. ITHERM, vol. 1, 2000, pp. 55-62.
-
(2000)
Proc. ITHERM
, vol.1
, pp. 55-62
-
-
Chiu, C.P.1
Solbrekken, G.L.2
Young, T.M.3
-
9
-
-
3242796481
-
Modeling and measurement of pressure-dependent junction-spreader thermal resistance for integrated circuits
-
P. Zhou and K. E. Goodson, "Modeling and measurement of pressure-dependent junction-spreader thermal resistance for integrated circuits," in Proc. ASME Int. Mechanical Engineering Congr. Expo., 2001, pp. 1-7.
-
(2001)
Proc. ASME Int. Mechanical Engineering Congr. Expo.
, pp. 1-7
-
-
Zhou, P.1
Goodson, K.E.2
-
10
-
-
0035474977
-
Surface chemistry and characteristics based model for the thermal contact resistance of fluidic interstitial thermal interface materials
-
R. S. Prasher, "Surface chemistry and characteristics based model for the thermal contact resistance of fluidic interstitial thermal interface materials," J. Heat Transf., vol. 123, pp. 969-975, 2001.
-
(2001)
J. Heat Transf.
, vol.123
, pp. 969-975
-
-
Prasher, R.S.1
-
11
-
-
0016025750
-
Thermal contact conductance: Theoretical considerations
-
B. B. Mikic, "Thermal contact conductance: Theoretical considerations," Int. J. Heat Mass Transf., vol. 17, pp. 205-214, 1974.
-
(1974)
Int. J. Heat Mass Transf.
, vol.17
, pp. 205-214
-
-
Mikic, B.B.1
-
12
-
-
0025725254
-
An approximate thermal contact conductance correlation
-
V. W. Antonetti, T. D. Whittle, and R. E. Simons, "An approximate thermal contact conductance correlation," Exper./Numer. Heat Transfer Combust. Phase Change, vol. 170, pp. 35-42, 1991.
-
(1991)
Exper./Numer. Heat Transfer Combust. Phase Change
, vol.170
, pp. 35-42
-
-
Antonetti, V.W.1
Whittle, T.D.2
Simons, R.E.3
-
13
-
-
3242752618
-
-
Private Communication
-
R. Hill, private communication, 2001.
-
(2001)
-
-
Hill, R.1
-
14
-
-
0003701462
-
-
Hibbitt, Karlsson, and Sorenson, Inc., Pawtucket, RI
-
ABAQUS Theory Manual, Hibbitt, Karlsson, and Sorenson, Inc., Pawtucket, RI, 1998.
-
(1998)
ABAQUS Theory Manual
-
-
-
15
-
-
0025386613
-
Analysis of tensile properties for a whisker-reinforced metal-matrix composite
-
V. Tvergaard, "Analysis of tensile properties for a whisker-reinforced metal-matrix composite," Acta. Metall. Mater., vol. 38, pp. 185-194, 1990.
-
(1990)
Acta. Metall. Mater
, vol.38
, pp. 185-194
-
-
Tvergaard, V.1
-
16
-
-
0027627240
-
Some simple models for micromechanical investigations of fiber arrangement effects in MMCs
-
H. J. Bohm, F. G. Rammerstorfer, and E. Weissenbek, "Some simple models for micromechanical investigations of fiber arrangement effects in MMCs," Comput. Mater. Sci., vol. 1, pp. 177-194, 1993.
-
(1993)
Comput. Mater. Sci.
, vol.1
, pp. 177-194
-
-
Bohm, H.J.1
Rammerstorfer, F.G.2
Weissenbek, E.3
-
17
-
-
3242795683
-
Determination of optimal filler volume fraction for thermal interface materials in electronics cooling applications
-
Grenoble, France
-
V. Singhal, S. V. Garimella, and T. Siegmund, "Determination of optimal filler volume fraction for thermal interface materials in electronics cooling applications," in Proc. Int. Heat Transfer Conf., vol. 3, Grenoble, France, 2002, pp. 9-14.
-
(2002)
Proc. Int. Heat Transfer Conf.
, vol.3
, pp. 9-14
-
-
Singhal, V.1
Garimella, S.V.2
Siegmund, T.3
|