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Volumn 27, Issue 2, 2004, Pages 244-252

Optimization of thermal interface materials for electronics cooling applications

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; FILLERS; FINITE ELEMENT METHOD; HEAT RESISTANCE; INTERFACES (MATERIALS); OPTIMIZATION; PARTICLE SIZE ANALYSIS; PRESSURE DISTRIBUTION; SURFACES; THERMAL CONDUCTIVITY; VOLUME FRACTION;

EID: 3242778561     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.828587     Document Type: Article
Times cited : (47)

References (17)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.