Use of superlattice thermionic emission for "hot spot" reduction in a convectively-cooled chip

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 610-616

  Solbrekken, Gary L ^a   Zhang, Yan ^b   Bar Cohen, Avram ^c   Shakouri, Ali ^b  

^a University of Missouri   (United States)

^b University of California Santa Cruz   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

Author keywords

Heterostructure; Non uniform heating; Numeric; Solid state cooling; Thermionic

Indexed keywords

NONUNIFORM HEATING; SOLID STATE COOLING; THERMAL MANAGEMENT; THERMIONIC;

COOLING; CURRENT DENSITY; ELECTRONIC EQUIPMENT; HEAT FLUX; HETEROJUNCTIONS; MICROPROCESSOR CHIPS; SUBSTRATES; THERMIONIC EMISSION;

SEMICONDUCTOR SUPERLATTICES;

EID: 4444337043     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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6. st International Conference on Thermoelectrics, Long Beach, CA, August 26-29, 2002.
7. Vashaee, D. and A. Shakouri, "Electronic And Thermoelectric Properties Of Semiconductor And Metalic Superlattices," Journal of Applied Physics, Vol. 95, 2004, pp. 1233-1245.