Integrated cooling for Si-based microelectronics

International Conference on Thermoelectrics, ICT, Proceedings

Volumn , Issue , 2001, Pages 405-408

  Fan, Xiaofeng ^a   Zeng, Gehong ^a   LaBounty, Chris ^a   Vashaee, Daryoosh ^a   Christofferson, James ^a   Shakouri, Ali ^a   Bowers, John E ^a  

^a University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; HIGH TEMPERATURE PROPERTIES; INTEGRATED CIRCUITS; MICROELECTRONICS; MOLECULAR BEAM EPITAXY; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR SUPERLATTICES; TEMPERATURE; THERMOCOUPLES;

HIGH COOLING POWER DENSITY; INTEGRATED CIRCUIT PROCESSING TECHNOLOGY; INTEGRATED THERMISTOR SENSORS; MICROLECTRONIC DEVICES; TEMPERATURE STABILIZATION; THERMOELECTRIC MATERIAL; THIN FILM THERMOELECTRIC COOLERS;

THERMOELECTRIC EQUIPMENT;

EID: 0035705644     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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