Direct liquid cooling of high flux micro and nano electronic components

Proceedings of the IEEE

Volumn 94, Issue 8, 2006, Pages 1549-1570

  Bar Cohen, Avram ^a,b   Arik, Mehmet ^a,c   Ohadi, Michael ^b  

^a IEEE   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

^c GE GLOBAL RESEARCH   (United States)

Author keywords

Dielectric liquids; Evaporation; Hot spots; Immersion cooling; Jet impingement; Liquid cooling; Pool boiling; Spray cooling; Synthetic jets

Indexed keywords

COOLING; ELECTRONIC EQUIPMENT; EVAPORATION; HEAT LOSSES; NANOSTRUCTURED MATERIALS; PHASE CHANGE MATERIALS;

HOT SPOTS; IMMERSION COOLING; JET IMPINGEMENT; POOL BOILING; SPRAY COOLING; SYNTHETIC JETS;

DIELECTRIC LIQUIDS;

EID: 33947242257     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/JPROC.2006.879791     Document Type: Article

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