Thin film thermoelectric cooler thermal validation and product thermal performance estimation

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 470-475

  Narasimhan, Sridhar ^a   Lofgreen, Kelly ^a   Chau, David ^a   Chrysler, Greg ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Cooling; Hot spot; Superlattice; Thermal modeling; Thermoelectric; Thin film thermoelectric cooler

Indexed keywords

HOT SPOT; THERMAL MODELING; THIN FILM THERMOELECTRIC COOLER;

COMPUTER SIMULATION; HEAT FLUX; PARAMETER ESTIMATION; SUPERLATTICES; THERMOELECTRIC EQUIPMENT; TRANSISTORS;

COOLING SYSTEMS;

EID: 33845593805     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645381     Document Type: Conference Paper

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