High performance miniature heat pipe

International Journal of Heat and Mass Transfer

Volumn 45, Issue 15, 2002, Pages 3131-3142

  Lin, Lanchao ^a   Ponnappan, Rengasamy ^b   Leland, John ^b  

^a UES INC   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARY FLOW; COOLING; ELECTRIC DISCHARGE MACHINING; FABRICATION; HEAT FLUX; HEATING;

HIGH HEAT FLUX ELECTRONICS;

HEAT PIPES;

AEROSPACE; FIN; HEAT TRANSFER; PERFORMANCE ASSESSMENT; PIPE;

EID: 0037141597     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0017-9310(02)00038-8     Document Type: Article

References (11)

1. New heat conductor for avionics cooling
2. Thermal control of electronic components by heat pipes and thermosyphons
3. Miniature heat pipes for heat removal from microelectronic circuits
4. Experiments and analyses of flat miniature heat pipes
5. Micro/miniature heat pipe technology for electronic cooling
6. A novel micro-capillary groove-wick miniature heat pipe
7. Investigation of vertical high-performance closed two-phase thermosyphons with perforated tube flow separators
8. Enhanced evaporative surface for two-phase mounting plates
9. Describing uncertainties in single-sample experiments