Review and assessment of pulsating heat pipe mechanism for high heat flux electronic cooling

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 52-59

  Karimi, G ^a,b   Culham, J R ^a  

^a UNIVERSITY OF WATERLOO   (Canada)

^b SHIRAZ UNIVERSITY   (Iran)

Author keywords

Electronic cooling; Heat sink; Pulsating heat pipe

Indexed keywords

BALL GRID ARRAYS; CROSS-SECTIONS; PACKAGE LEADS; SURFACE AREA;

COOLING; DENSITY (SPECIFIC GRAVITY); ELECTRONICS PACKAGING; HEAT FLUX; HEAT RESISTANCE; HEAT TRANSFER; SUBSTRATES; SURFACE TENSION;

HEAT PIPES;

EID: 4444308440     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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