Fluxless process of fabricating In-Au joints on copper substrates

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 2, 2000, Pages 377-382

  So, William W ^a   Lee, Chin C ^b  

^a Alpha Photonics Inc   (United States)

^b University of California at Irvine   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DYES; ENERGY DISPERSIVE SPECTROSCOPY; GOLD ALLOYS; INDIUM ALLOYS; SCANNING ELECTRON MICROSCOPY; SILICON; SOLDERING ALLOYS; SUBSTRATES; THERMAL CYCLING; THERMAL EXPANSION; WELDS;

COPPER SUBSTRATES; FLUXLESS BONDING TECHNIQUE; INDIUM GOLD ALLOY;

COPPER;

EID: 0033702855     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.846777     Document Type: Article

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