Nickel-tin transient liquid phase (TLP) wafer bonding for MEMS vacuum packaging

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 1327-1328

  Welch III, W C ^a   Najafi, K ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Diffusion soldering; MEMS packaging; Solder; Transient liquid phase; Vacuum packaging; Wafer bonding

Indexed keywords

ACTUATORS; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; GETTERS; LIQUID PHASE EPITAXY; MICROSYSTEMS; NICKEL; NICKEL ALLOYS; RELIABILITY; SENSORS; TIN; TITANIUM; TITANIUM COMPOUNDS; TRANSDUCERS; VACUUM;

DIFFUSION SOLDERING; INTERNATIONAL CONFERENCES; LOWER PRESSURES; MEMS PACKAGING; SOLDER; SOLID-STATE SENSORS; TRANSIENT LIQUID PHASE; VACUUM PACKAGING; VACUUM SENSORS;

WAFER BONDING;

EID: 47249164130     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300385     Document Type: Conference Paper

References (5)

1. G. Humpston, Principles of soldering, Materials Park, OH : ASM International, 2004.
2. P.K. Khanna, et. al, "Morphology and long term stability of Ni/Ni interconnections based on diffusion soldering," Zeitschrift Fuer Metallkunde, vol. 90, pp. 722-726, 1999.
3. N.S. Bosco, et. al, "Critical interlayer thickness for transient liquid phase bonding in the Cu-Sn system," Acta Materialia, vol. 52, pp. 2965-2972, 2004.
4. W.C. Welch, et. al, "Transient Liquid Phase Bonding for Microsystem Packaging Applications," Transducers '05, 2005,p1350-1353.
5. Mithcell, J.S., et al., "An improved performance poly Si Pirani vacuum gauge using heat distributing structural supports" MEMS 2005 Technical Digest, Jan 30 - Feb 3 2005, 2005, pp. 291-294.