SCOPUS 정보 검색 플랫폼

Materials Science and Engineering: A

Volumn 393, Issue 1-2, 2005, Pages 315-319

Nucleation and growth of intermetallics and gold clusters on thick tin layers in electroplating process

(4) Kim, Dongwook a Kim, Jongsung a Wang, Gow L a,b Lee, Chin C a

a UNIVERSITY OF CALIFORNIA (United States)

b NATIONAL SUN YAT SEN UNIVERSITY (Taiwan)

Author keywords

AuSn4; Electroplating; Fluxless bonding; Fluxless soldering; Gold; Intermetallic compounds; Tin

Indexed keywords

DIFFUSION; ELECTROPLATING; ENERGY DISPERSIVE SPECTROSCOPY; FLUXES; GOLD; GOLD ALLOYS; GROWTH (MATERIALS); NUCLEATION; SCANNING ELECTRON MICROSCOPY; SOLDERING; TIN; X RAY DIFFRACTION ANALYSIS;

DIFFUSION-CONTROLLED PROCESS; GOLD CLUSTERS; GROWTH MECHANISMS; GROWTH OF INTERMETALLICS;

INTERMETALLICS;

ELECTROPLATING; INDUSTRIAL APPLICATION; INTERMETALLIC ALLOY; NUCLEATION;

EID: 13344275144 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2004.11.022 Document Type: Article

Times cited : (20)

References (8)

1
- 0038688994
- Fluxless flip chip technique with Sn-rich Au/Sn solder bumps
- D. Kim C.C. Lee Fluxless flip chip technique with Sn-rich Au/Sn solder bumps in: Proceedings of the 53rd IEEE Electronic Components and Technology Conference 2003 840-843
- (2003) Proceedings of the 53rd IEEE Electronic Components and Technology Conference , pp. 840-843
- Kim, D.¹ Lee, C.C.²

2
- 2442625278
- Fluxless process of producing tin-rich gold-tin joints in air
- R.W. Chuang D. Kim J. Park C.C. Lee Fluxless process of producing tin-rich gold-tin joints in air IEEE Trans. Comp. Packag. Technol. 27 2004 177-181
- (2004) IEEE Trans. Comp. Packag. Technol. , vol.27 , pp. 177-181
- Chuang, R.W.¹ Kim, D.² Park, J.³ Lee, C.C.⁴

3
- 0002918482
- A study of evaporated gold-tin films using transmission electron microscopy: II
- L. Buene H. Falkenberg-Arell J. Gjonnes J. Taft A study of evaporated gold-tin films using transmission electron microscopy: II Thin Solid Films 67 1980 95-102
- (1980) Thin Solid Films , vol.67 , pp. 95-102
- Buene, L.¹ Falkenberg-Arell, H.² Gjonnes, J.³ Taft, J.⁴

4
- 0019876355
- Room temperature interdiffusion studies of Au/Sn thin film couples
- S. Nakahara R.J. McCoy L. Buene J.M. Vandenberg Room temperature interdiffusion studies of Au/Sn thin film couples Thin Solid Films 84 1981 185-196
- (1981) Thin Solid Films , vol.84 , pp. 185-196
- Nakahara, S.¹ McCoy, R.J.² Buene, L.³ Vandenberg, J.M.⁴

5
- 0020249397
- Interdiffusion and phase formation in Au/Sn thin film couples with special emphasis on substrate temperature during condensation
- B. Hugsted L. Buene T. Einstad O. Lonsjo T. Olsen Interdiffusion and phase formation in Au/Sn thin film couples with special emphasis on substrate temperature during condensation Thin Solid Films 94 1982 81-94
- (1982) Thin Solid Films , vol.94 , pp. 81-94
- Hugsted, B.¹ Buene, L.² Einstad, T.³ Lonsjo, O.⁴ Olsen, T.⁵

6
- 0042887508
- Fluxless non-eutectic joints fabricated using gold-tin multilayer composite
- C.C. Lee R.W. Chuang Fluxless non-eutectic joints fabricated using gold-tin multilayer composite IEEE Trans. Comp. Packag. Technol. 26 2 2003 416-422
- (2003) IEEE Trans. Comp. Packag. Technol. , vol.26 , Issue.2 , pp. 416-422
- Lee, C.C.¹ Chuang, R.W.²

7
- 0025459048
- Thermal expansion and elastic properties of high gold-tin alloys
- F.G. Yost M.M. Karnowsky W.D. Drotning J.H. Gieske Thermal expansion and elastic properties of high gold-tin alloys Metall. Trans. A 21A 1990 1885-1889
- (1990) Metall. Trans. A , vol.21 A , pp. 1885-1889
- Yost, F.G.¹ Karnowsky, M.M.² Drotning, W.D.³ Gieske, J.H.⁴

8
- 36849115861
- Diffusion of gold and silver in tin single crystals
- B.F. Dyson Diffusion of gold and silver in tin single crystals J. Appl. Phys. 37 6 1966 2375-2377
- (1966) J. Appl. Phys. , vol.37 , Issue.6 , pp. 2375-2377
- Dyson, B.F.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.