Fluxless wafer-level Cu-Sn bonding for micro- and nanosystems packaging

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Hoivik, Nils ^a   Wang, Kaiying ^a   Aasmundtveit, Knut ^a   Salomonsen, Guttorm ^a   Lapadatu, Adriana ^b   Kittilsland, Gjermund ^b   Stark, Birger ^b  

^a UNIVERSITY OF SOUTH EASTERN NORWAY   (Norway)

^b Sensonor Technologies AS   (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATED FILMS; FLUXLESS; OXIDATION BARRIER; PRECLEANING; TEMPERATURE CYCLING; WAFER LEVEL; WAFER-LEVEL HERMETIC PACKAGING;

COPPER; ELECTRONICS PACKAGING; NANOSYSTEMS; SHEAR STRENGTH; TIN;

WAFER BONDING;

EID: 78651297984     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5643013     Document Type: Conference Paper

References (9)

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