Metal-bonded, hermetic 0-level package for MEMS

2010 12th Electronics Packaging Technology Conference, EPTC 2010

Volumn , Issue , 2010, Pages 1-6

  Pham, Nga P ^a   Limaye, Paresh ^a   Czarnecki, Piotr ^a   Pedreira, Olalla Varela ^a   Cherman, Vladimir ^a   Tezcan, Deniz S ^a   Tilmans, Harrie A C ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING PROCESS; CAPPING CHIPS; CAPPING WAFERS; CU LAYERS; DIFFUSION SOLDERING; DOUBLE LAYERS; HERMETIC PACKAGES; LEAK TESTING; MEMBRANE DEFLECTIONS; METALLIC BONDS; SEALING RING; TEMPERATURE AND FORCE; ZERO-LEVEL PACKAGING;

CHIP SCALE PACKAGES; DIES; ELECTRONIC EQUIPMENT MANUFACTURE; TECHNOLOGY; TIN; WAFER BONDING;

PACKAGING;

EID: 79951877713     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2010.5702595     Document Type: Conference Paper

References (11)

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