A novel and efficient packaging technology for RF-MEMS devices

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1239-1245

  Theunis, F ^a   Lisec, T ^b   Reinert, W ^b   Bielen, J ^a   Yang, D ^a   De Jongh, M ^a   Krusemann, P V E ^c  

^a NXP SEMICONDUCTORS   (Netherlands)

^b FRAUNHOFER INSTITUTE FOR SILICON TECHNOLOGY ISIT   (Germany)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ECONOMIC ANALYSIS; MEMS; MICROFABRICATION; MOBILE PHONES; SEMICONDUCTOR MATERIALS; WIRELESS TELECOMMUNICATION SYSTEMS;

CELL PHONE COMPONENTS; RF-MEMS DEVICES; STABLE ATMOSPHERE; WIRELESS COMMUNICATION;

ELECTRONICS PACKAGING;

EID: 35348831036     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373953     Document Type: Conference Paper

References (3)

1. th International Conference on Electronic Packaging Technology, August p2005, pp. 508-513.
2. th Electronics Packaging Technology Conf, December 2005, pp. 225-230.
3. th International IEEE EuroSimE conf, Berlin, Germany, April 2005, pp. 290-296.