Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents

Journal of Adhesion

Volumn 89, Issue 11, 2013, Pages 847-858

  Ho, Li Ngee ^a,b   Wu, Teng Fei ^a   Nishikawa, Hiroshi ^a  

^a OSAKA UNIVERSITY   (Japan)

^b UNIVERSITY MALAYSIA PERLIS   (Malaysia)

Author keywords

Conductive adhesives; Coupling agents; Electrical resistivity; Rheology; Shear strength

Indexed keywords

CONDUCTIVE ADHESIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; FILLER CONTENTS; RHEOLOGICAL PROPERTY; SILANE COUPLING; SILANE COUPLING AGENT;

COUPLING AGENTS; CURING; ELECTRIC CONDUCTIVITY; MECHANICAL PROPERTIES; RHEOLOGY; SHEAR STRENGTH;

SILVER;

EID: 84879640893     PISSN: 00218464     EISSN: 15455823     Source Type: Journal    
DOI: 10.1080/00218464.2013.775039     Document Type: Article

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