Microstructural changes of the Ag-Epoxy ICA/Sn interface in a high-humidity environment

Journal of Electronic Materials

Volumn 38, Issue 6, 2009, Pages 896-901

  Kim, Sun Sik ^a   Kim, Keun Soo ^a   Kim, Seong Jun ^a   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Ag epoxy conductive adhesive; Degradation mechanism; ICA; Interfacial microstructure; Lead free solder; Sn oxide; TEM

Indexed keywords

AG-EPOXY CONDUCTIVE ADHESIVE; DEGRADATION MECHANISM; ICA; INTERFACIAL MICROSTRUCTURE; LEAD-FREE SOLDER; SN OXIDE; TEM;

ATMOSPHERIC HUMIDITY; BRAZING; DEGRADATION; HEMODYNAMICS; INDEPENDENT COMPONENT ANALYSIS; LEAD; MICROSTRUCTURE; MOISTURE; OXIDES; SILVER; WELDING;

TIN;

EID: 67650418115     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0738-y     Document Type: Conference Paper

References (23)

1. K. Suganuma 2001 Curr. Opin. Solid State Mater. Sci. 5 55 10.1016/S1359-0286(00)00036-X
2. K.C.R. Abell Y.-L. Shen 2002 Acta Mater. 50 3193 10.1016/S1359-6454(02) 00135-0
3. Yi. Li C.P. Wong 2006 Mater. Sci. Eng. R 51 1 10.1016/j.mser.2006.01.001
4. I. Mir D. Kumar 2008 Int. J. Adhes. Adhes. 28 362 10.1016/j.ijadhadh. 2007.10.004
5. S.K. Kang S. Purushothaman 1999 J. Electron. Mater. 28 1314 10.1007/s11664-999-0173-0
6. H.P. Wu X.J. Wu M.Y. Ge G.Q. Zhang Y.W. Wang J.Z. Jiang 2007 Compos. Sci. Technol. 67 1116 10.1016/j.compscitech.2006.05.017
7. D. Lu Q.K. Tong C.P. Wong 1999 IEEE Trans. Electron. Packag. Manuf. 22 223 10.1109/6104.795857
8. M. Yamashita K. Suganuma 2006 Microelectron. Reliab. 46 1113 10.1016/j.microrel.2005.07.112
9. M. Yamashita K. Suganuma 2003 J. Mater. Sci. Lett. 22 1311 10.1023/A:1025766723541
10. F. Tan X. Qiao J. Chen H. Wang 2006 Int. J. Adhes. Adhes. 26 406 10.1016/j.ijadhadh.2005.06.005
11. M. Yamashita K. Suganuma 2002 J. Electron. Mater. 31 551 10.1007/s11664-002-0124-5
12. M. Yamashita K. Suganuma 2006 J. Mater. Sci. Lett. 41 583
13. D. Lu C.P. Wong 1999 J. Appl. Polym. Sci. 74 399 10.1002/(SICI)1097- 4628(19991010)74:2<399::AID-APP22>3.0.CO;2-F
14. M. Yamashita K. Suganuma 2006 Microelectron. Reliab. 46 850 10.1016/j.microrel.2005.05.020
15. D. Lu Q.K. Tong C.P. Wong 1999 IEEE Trans. Electron. Packag. Manuf. 22 228 10.1109/6104.795858
16. S. Xu D.A. Dillard J.G. Dillard 2003 Int. J. Adhes. Adhes. 23 235
17. G. Gordillo L.C. Moreno W. de la Cruz P. Teheran 1994 Thin Solid Films 252 61 10.1016/0040-6090(94)90826-5
18. R.S. Goodchild J.B. Webb D.F. Williams 1985 J. Appl. Phys. 57 2308 10.1063/1.334331
19. M. Fantini I. Torriani 1986 Thin Solid Films 138 255 10.1016/0040- 6090(86)90398-6
20. D. Das R. Banerjee 1987 Thin Solid Films 147 321 10.1016/0040-6090(87) 90028-9
21. E.A. Brandes and G.B. Brook, Smithells metals reference book (7th ed.), Butterworth-Heinemann Ltd (Oxford, 1992), pp. 14-27
22. L. Kaplan I. Rusman R.L. Boxman S. Goldsmith M. Nathan E. Ben-Jacob 1996 Thin Solid Films 290-291 355 10.1016/S0040-6090(96)09173-0
23. P.S. Patil R.K. Kawar T. Seth D.P. Amalnerkar P.S. Chigare 2003 Ceram. Int. 29 725 10.1016/S0272-8842(02)00224-9