Effect of silane-based coupling agent on the properties of silver nanoparticles filled epoxy composites

Composites Science and Technology

Volumn 67, Issue 11-12, 2007, Pages 2584-2591

  Tee, D I ^a   Mariatti, M ^a   Azizan, A ^a   See, C H ^b   Chong, K F ^b  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

^b Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

A. Coupling agent; A. Polymer matrix composites (PMC); B. Electrical properties; B. Surface treatment surfaces

Indexed keywords

ADHESION; BENDING STRENGTH; ELECTRIC PROPERTIES; EPOXY RESINS; MICROELECTRONICS; MORPHOLOGY; NANOPARTICLES; SILANES; SILVER;

INSULATOR-TO-CONDUCTOR TRANSITION; PERCOLATION THRESHOLD; SILVER NANOPARTICLES-FILLED EPOXY COMPOSITES;

POLYMER MATRIX COMPOSITES;

ADHESION; COMPOSITE; COMPOSITE PROPERTY; COUPLING AGENT; ELECTRICAL PROPERTY; EPOXY RESIN; MATRIX; MORPHOLOGY; PARTICLE; POLYMER; SILVER;

EID: 34249320546     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2006.12.007     Document Type: Article

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