Effect of coupling agents on thermal, flow, and adhesion properties of epoxy/silica compounds for capillary underfill applications

Powder Technology

Volumn 230, Issue , 2012, Pages 145-150

  Heo, Gun Young ^a   Park, Soo Jin ^a  

^a Inha University   (South Korea)

Author keywords

Dispersion forces; Epoxy silica systems; Penetration rate; Reactive functional groups; Silane coupling agent

Indexed keywords

ADHESION PROPERTIES; COEFFICIENTS OF THERMAL EXPANSIONS; CURING BEHAVIOR; DISPERSION FORCE; EPOXY COMPOUND; FLOW PROPERTIES; PENETRATION RATES; REACTIVE FUNCTIONAL GROUPS; SHEAR STRENGTH TESTING; SILANE COUPLING AGENT; UNDERFILLS;

ADHESION; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DISPERSIONS; EPOXY RESINS; ETHERS; FUNCTIONAL GROUPS; MECHANICAL PROPERTIES; SILICA;

COUPLING AGENTS;

EPOXIDE; EPOXY RESIN; IMIDAZOLE; SILICON DIOXIDE;

ADHESION; ARTICLE; CHEMICAL COMPOSITION; CHEMICAL STRUCTURE; DIFFERENTIAL SCANNING CALORIMETRY; DISPERSION; FLOW RATE; LOW TEMPERATURE; MECHANICS; POLYMERIZATION; SHEAR STRENGTH; THERMAL ANALYSIS; VISCOSITY;

EID: 84865179270     PISSN: 00325910     EISSN: 1873328X     Source Type: Journal    
DOI: 10.1016/j.powtec.2012.07.022     Document Type: Article

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