Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive

Journal of Adhesion

Volumn 86, Issue 8, 2010, Pages 807-815

  Ho, Li Ngee ^a,b   Wu, Teng Fei ^a   Nishikawa, Hiroshi ^a   Takemoto, Tadashi ^a  

^a OSAKA UNIVERSITY   (Japan)

^b UNIVERSITY MALAYSIA PERLIS   (Malaysia)

Author keywords

Aging; Copper and alloy; Electrical properties; Phenolic

Indexed keywords

ADHESIVES; AGING OF MATERIALS; ELECTRIC PROPERTIES; PHENOLIC RESINS;

AFTER HIGH TEMPERATURE; ELECTRICALLY CONDUCTIVE ADHESIVES; HIGH-TEMPERATURE EXPOSURE; LONG TERM STABILITY; METALLIC FILLERS; PHENOLIC; TRACE AMOUNTS;

COPPER ALLOYS;

EID: 77955462968     PISSN: 00218464     EISSN: 15455823     Source Type: Journal    
DOI: 10.1080/00218464.2010.498310     Document Type: Article

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