Study on properties of conductive adhesive prepared with silver nanoparticles modified by silane coupling agent

Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering

Volumn 41, Issue 1, 2012, Pages 24-27

  Li, Xianxue ^a   Zheng, Bingyun ^a   Xu, Limei ^a   Wu, Dandan ^a   Liu, Zonglin ^a   Zhang, Huichai ^a  

^a PUTIAN UNIVERSITY   (China)

Author keywords

Conductive adhesive; KH 560; Nano silver powders; Silane coupling agent

Indexed keywords

AG NANOPARTICLE; BULK RESISTIVITY; CONDUCTIVE ADHESIVE; CONDUCTIVE FILLERS; CURING TIME; EPOXIDE RESINS; FOURIER TRANSFORM INFRARED SPECTRA; FTIR; KH-560; MINIMAL VALUE; NANO POWDERS; NANO SILVER; SILANE COUPLING AGENT; SILVER CONTENT; SILVER NANOPARTICLES; SILVER PARTICLES;

COUPLING AGENTS; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; NANOPARTICLES; POWDERS; TRANSMISSION ELECTRON MICROSCOPY;

SILVER;

EID: 84863166798     PISSN: 1002185X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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