Drop impact reliability of Sn-1.0Ag-0.5Cu BGA interconnects with different mounting methods

Microelectronics Reliability

Volumn 52, Issue 7, 2012, Pages 1475-1482

  Wang, Bo ^a,b   Li, Jiajun ^a   Gallagher, Anthony ^b   Wrezel, James ^b   Towashirporn, Pongpinit ^b   Zhao, Naiqin ^a  

^a TIANJIN UNIVERSITY   (China)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BGA SOLDER JOINTS; BONDING STRENGTH; DIPPING METHOD; DROP IMPACT; FAILURE STRAIN; FOUR-POINT BEND; INTERFACIAL INTERMETALLICS; LIQUIDUS; LOW HARDNESS; PASTE PRINTING; RESEARCH AND APPLICATION; SAC-SOLDERS; SN-AG-CU; SOLDER ALLOYS; SOLDER INTERCONNECTS; SOLDER PASTE PRINTING; SURFACE MOUNTING;

ALLOYS; DROPS; ELECTRONICS PACKAGING; PRINTING; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; TIN ALLOYS;

TIN;

EID: 84862814197     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.02.001     Document Type: Article

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