Pb-free solder: SAC105 vs SAC305 drop-test reliability data comparison

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2007, Pages 251-255

  Iyer, Ganesh ^a   Ouyang, Eric ^a   Kittidacha, Witoon ^a   Tantideeravit, Soratos ^a   Suresh, L K ^a  

^a Submicron Development Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DROP TESTING; ELECTRONICS MANUFACTURING; EXPERIMENTAL DATA; FAILURE MECHANISMS; LIMITED DATA; MOBILE APPLICATIONS; NUMERICAL SIMULATIONS; PB-FREE; PB-FREE SOLDERS; RELIABILITY DATA; RELIABILITY TESTING; ROHS COMPLIANCE; TEST RELIABILITY;

BRAZING; COMPUTER SIMULATION; DROPS; FLUID MECHANICS; LEAD; LEAD ALLOYS; SOLDERING; SOLDERING ALLOYS; TECHNOLOGY; TESTING; TIN ALLOYS; WELDING;

TIN;

EID: 48149090559     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2007.4417072     Document Type: Conference Paper

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