Beneficial alloy effects in tin-silver-copper-X solder joints for high temperature applications

Proceedings of the 3rd International Brazing and Soldering Conference

Volumn 2006, Issue , 2006, Pages 18-25

  Anderson, I E ^a   Harringa, J L ^a  

^a IOWA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; DUCTILITY; ELECTRONIC EQUIPMENT; INTERMETALLICS; PORTABLE EQUIPMENT; SOLDERED JOINTS; TIN COMPOUNDS;

DROP IMPACT FAILURE; IZOD IMPACT STRENGTH; SOLDER MATRIX; THERMAL AGING;

SOLDERING ALLOYS;

EID: 33751398199     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (25)

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