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Journal of Electronic Materials
Volumn 39, Issue 12, 2010, Pages 2627-2635
Microstructural variation and phase evolution in the reaction of Sn-xAg-Cu solders and Cu-yZn substrates during reflow
Author keywords

compounds; Cu Zn; interfacial reaction; intermetallic; lead free solders; Soldering; under bump metallurgy (UBM)
Indexed keywords

COMPOUNDS; CU-ZN; INTERFACIAL REACTIONS; LEAD-FREE SOLDERS; UNDER-BUMP METALLURGIES;
EID: 78049529009     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1349-3     Document Type: Conference Paper
Times cited : (10)
References (20)
  • 2
    • 0037323121 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD3sXhtVGqu7c%3D 10.1063/1.1517165 2003JAP.93.1335T
    • KN Tu AM Gusak M Li 2003 J. Appl. Phys. 93 1335 1:CAS:528: DC%2BD3sXhtVGqu7c%3D 10.1063/1.1517165 2003JAP....93.1335T
    • (2003) J. Appl. Phys. , vol.93 , pp. 1335
    • Tu, K.N.1    Gusak, A.M.2    Li, M.3
  • 3
    • 32644434009 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD28Xht1Omtbc%3D 10.1007/s11664-006-0190-1 2006JEMat.35.94A
    • IE Anderson JL Harringa 2006 J. Electron. Mater. 35 94 1:CAS:528:DC%2BD28Xht1Omtbc%3D 10.1007/s11664-006-0190-1 2006JEMat..35...94A
    • (2006) J. Electron. Mater. , vol.35 , pp. 94
    • Anderson, I.E.1    Harringa, J.L.2
  • 4
    • 33845694955 scopus 로고    scopus 로고
    • Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications
    • DOI 10.1007/s10854-006-9011-9
    • IE Anderson 2007 J. Mater. Sci. Mater. Electron. 18 55 1:CAS:528:DC%2BD28XhtlWntLvJ 10.1007/s10854-006-9011-9 (Pubitemid 44963677)
    • (2007) Journal of Materials Science: Materials in Electronics , vol.18 , Issue.1-3 , pp. 55-76
    • Anderson, I.E.1
  • 5
    • 35248860213 scopus 로고    scopus 로고
    • Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging
    • DOI 10.1007/s11664-007-0254-x
    • MG Cho SK Kang DY Shih HM Lee 2007 J. Electron. Mater. 36 1501 1:CAS:528:DC%2BD2sXht1Cku7vM 10.1007/s11664-007-0254-x 2007JEMat..36.1501C (Pubitemid 47561764)
    • (2007) Journal of Electronic Materials , vol.36 , Issue.11 , pp. 1501-1509
    • Cho, M.G.1    Kang, S.K.2    Shih, D.-Y.3    Lee, H.M.4
  • 8
    • 21344462667 scopus 로고    scopus 로고
    • Improvement of microstructure and interface structure of eutectic Sn-0.7Cu solder with small amount of Zn addition
    • DOI 10.1016/j.scriptamat.2005.05.013, PII S1359646205003155
    • FJ Wang X Ma Y Qian 2005 Scripta Mater. 53 699 1:CAS:528: DC%2BD2MXlvV2rtbs%3D 10.1016/j.scriptamat.2005.05.013 (Pubitemid 40908830)
    • (2005) Scripta Materialia , vol.53 , Issue.6 , pp. 699-702
    • Wang, F.1    Ma, X.2    Qian, Y.3
  • 9
    • 69949165023 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD1MXhtFWlu7nI 10.1016/j.actamat.2009.06.060
    • JY Kim J Yu SH Kim 2009 Acta Mater. 57 5001 1:CAS:528:DC%2BD1MXhtFWlu7nI 10.1016/j.actamat.2009.06.060
    • (2009) Acta Mater. , vol.57 , pp. 5001
    • Kim, J.Y.1    Yu, J.2    Kim, S.H.3
  • 11
    • 44449117311 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD1cXmsFaisbk%3D 10.1016/j.actamat.2008.01.055
    • HF Zou HJ Yang ZF Zhang 2008 Acta Mater. 56 2649 1:CAS:528: DC%2BD1cXmsFaisbk%3D 10.1016/j.actamat.2008.01.055
    • (2008) Acta Mater. , vol.56 , pp. 2649
    • Zou, H.F.1    Yang, H.J.2    Zhang, Z.F.3
  • 12
    • 34249034702 scopus 로고    scopus 로고
    • y alloy underbump metallurgy and Sn-Ag-zCu solders
    • DOI 10.1007/s11664-006-0049-5
    • H Han YC Sohn J Yu 2007 J. Electron. Mater. 36 578 1:CAS:528: DC%2BD2sXntVKks7o%3D 10.1007/s11664-006-0049-5 2007JEMat..36..578H (Pubitemid 46790866)
    • (2007) Journal of Electronic Materials , vol.36 , Issue.5 , pp. 578-586
    • Han, H.1    Sohn, Y.C.2    Yu, J.3
  • 13
    • 61749087132 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD1MXitlygtbk%3D 10.1557/jmr.2009.0047 2009JMatR.24.297O
    • CY Oh H Roh YM Kim JS Lee HY Cho Y Kim 2009 J. Mater. Res. 24 297 1:CAS:528:DC%2BD1MXitlygtbk%3D 10.1557/jmr.2009.0047 2009JMatR..24..297O
    • (2009) J. Mater. Res. , vol.24 , pp. 297
    • Oh, C.Y.1    Roh, H.2    Kim, Y.M.3    Lee, J.S.4    Cho, H.Y.5    Kim, Y.6
  • 14
    • 61649119014 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD1MXjtFOitbw%3D 10.1016/j.jallcom.2008.06.141
    • MG Cho S Seo HM Lee 2009 J. Alloys Compd. 474 510 1:CAS:528: DC%2BD1MXjtFOitbw%3D 10.1016/j.jallcom.2008.06.141
    • (2009) J. Alloys Compd. , vol.474 , pp. 510
    • Cho, M.G.1    Seo, S.2    Lee, H.M.3
  • 15
    • 77951257605 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BC3cXnvFaltQ%3D%3D 10.1007/s11664-009-0992-z 2010JEMat.39.230Y
    • CY Yu KJ Wang JG Duh 2010 J. Electron. Mater. 39 230 1:CAS:528: DC%2BC3cXnvFaltQ%3D%3D 10.1007/s11664-009-0992-z 2010JEMat..39..230Y
    • (2010) J. Electron. Mater. , vol.39 , pp. 230
    • Yu, C.Y.1    Wang, K.J.2    Duh, J.G.3
  • 16
    • 65549095522 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD1MXlvFKitbo%3D 10.1016/j.scriptamat.2009.04.009
    • HF Zou QK Zhang ZF Zhang 2009 Scripta Mater. 61 308 1:CAS:528: DC%2BD1MXlvFKitbo%3D 10.1016/j.scriptamat.2009.04.009
    • (2009) Scripta Mater. , vol.61 , pp. 308
    • Zou, H.F.1    Zhang, Q.K.2    Zhang, Z.F.3
  • 18
    • 70350389031 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD1MXhtlWjurbJ 10.2320/matertrans.M2009127
    • MG Cho SK Seo HM Lee 2009 Mater. Trans. 50 2291 1:CAS:528: DC%2BD1MXhtlWjurbJ 10.2320/matertrans.M2009127
    • (2009) Mater. Trans. , vol.50 , pp. 2291
    • Cho, M.G.1    Seo, S.K.2    Lee, H.M.3
  • 19
    • 0041154484 scopus 로고    scopus 로고
    • 1:CAS:528:DyaK2sXkvFOgtrk%3D 10.1016/S1359-6462(97)00129-2
    • A Hayashi CR Kao YA Chang 1997 Scripta Mater. 37 393 1:CAS:528: DyaK2sXkvFOgtrk%3D 10.1016/S1359-6462(97)00129-2
    • (1997) Scripta Mater. , vol.37 , pp. 393
    • Hayashi, A.1    Kao, C.R.2    Chang, Y.A.3
  • 20
    • 33646133660 scopus 로고    scopus 로고
    • 1:CAS:528:DC%2BD28XktVajtLw%3D 10.1016/j.actamat.2006.01.014
    • CY Chou SW Chen 2006 Acta Mater. 54 2393 1:CAS:528:DC%2BD28XktVajtLw%3D 10.1016/j.actamat.2006.01.014
    • (2006) Acta Mater. , vol.54 , pp. 2393
    • Chou, C.Y.1    Chen, S.W.2

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.