The study on the novel lead-free solder alloy

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 191-193

  Huang, Le ^a   Wang, Qian ^a   Ma, Jusheng ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD; MELTING; MODIFIED ATMOSPHERE PACKAGING; PACKAGING MATERIALS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN; TIN ALLOYS; ZINC;

ELECTRONIC INDUSTRIES; EUTECTIC SOLDERS; LEAD-FREE SOLDER ALLOY; MELTING RANGE; SN-AG-CU; SN-AG-ZN; SNPB SOLDER; SOLDER ALLOYS;

LEAD-FREE SOLDERS;

EID: 0141876592     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904152     Document Type: Conference Paper

References (3)

1. Wood, E.P., Nimmo,K.L. "In Search of New Lead-Free Electronic Solders", Journal of Electronic Materials, Vol.23. No.8, 1994
2. Loomans, M.E., Vaynman, S. "Investigation of Multi-Component Lead-Free Solders", Journal of Electronic Materials, Vol.23. No.8. 1994
3. Ohnuma, I., Miyashita, M., "Phase Equilibria and Thermodynamic Properties of Sn-Ag Based P-free Solder Alloys", 2000 IEMT/IMC Symposium, April 2000, pp 104-109