Effect of electrodeposition conditions on Kirkendall void formation between electrodeposited Cu film and Sn-3.5Ag solder

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1620-1625

  Kim, Jong Yeon ^a   Yu, Jin ^a   Lee, Taek Young ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Hanbat National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; BRITTLENESS; FRACTURE; INTERFACES (MATERIALS); THERMAL AGING;

INTERFACIAL REACTION; SOLDER INTERFACE;

ELECTRODEPOSITION;

EID: 35348857409     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374011     Document Type: Conference Paper

References (11)

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