Evaluation of Cu-bumps with lead-free solders for flip-chip package applications

Microelectronic Engineering

Volumn 86, Issue 12, 2009, Pages 2392-2395

  Lin, Kung Liang ^a   Chang, Edward Yi ^a   Shih, Lin Chi ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Copper bump; Electroplating; Lead free

Indexed keywords

COPPER BUMP; COPPER BUMPS; CU DIFFUSION BARRIER; ENVIRONMENTAL-FRIENDLY; FATIGUE FAILURES; FLIP CHIP APPLICATIONS; FLIP-CHIP PACKAGES; HIGH ASPECT RATIO; LEAD FREE SOLDERS; LEAD-FREE; LOW COSTS; NEGATIVE PHOTORESISTS; SEED LAYER; SHEAR FORCE;

ASPECT RATIO; COPPER; ELECTROPLATING; FLIP CHIP DEVICES; GOLD; LEAD; SOLDERING ALLOYS;

TIN;

EID: 70349773180     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.04.027     Document Type: Article

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