Negative oxygen ion formation in reactive magnetron sputtering processes for transparent conductive oxides

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 30, Issue 6, 2012, Pages

  Welzel, Thomas ^a   Ellmer, Klaus ^a  

^a HAHN MEITNER INSTITUT   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION FACTORS; D.C. MAGNETRON SPUTTERING; ENERGY DISTRIBUTIONS; ENERGY-RESOLVED MASS SPECTROMETRY; ION FORMATION; ION PRODUCTION; METAL TARGET; ORDERS OF MAGNITUDE; REACTIVE MAGNETRON SPUTTERING; SPUTTERING PROCESS; SPUTTERING RATE; TARGET MATERIALS; TRANSPARENT CONDUCTIVE OXIDE THIN FILM; TRANSPARENT CONDUCTIVE OXIDES;

MAGNETRON SPUTTERING; MASS SPECTROMETRY; RADIATION DAMAGE; TIN;

NEGATIVE IONS;

EID: 84870026471     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.4762815     Document Type: Article

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