Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn , Issue , 2012, Pages 574-587

  Brunschwiler, T ^a   Paredes, S ^a   Drechsler, U ^a   Michel, B ^a   Wunderle, B ^b   Reichl, H ^c  

^a IBM RESEARCH ZURICH   (Switzerland)

^b FRAUNHOFER INSTITUTE FOR ELECTRONIC NANO SYSTEMS ENAS   (Germany)

^c TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

angle of attack; Extended tensor description; interlayer cooling; multi scale modeling; nonuniform heat transfer; pin fin; porous media

Indexed keywords

ENERGY TRANSPORT; EXTENDED TENSOR DESCRIPTION; FLOW DIRECTION; FLUID CAVITIES; FLUID DELIVERY; HEAT REMOVAL; HOT SPOT; JUNCTION TEMPERATURES; MASS FLOW; MULTI-SCALE MODELING; PERIODIC BOUNDARY CONDITIONS; PIN-FIN ARRAYS; PIN-FINS; SILICON DIE; STACK MODEL; SUBDOMAIN;

ANGLE OF ATTACK; COOLING; ELECTRONICS ENGINEERING; FINS (HEAT EXCHANGE); POROUS MATERIALS; POROUS SILICON; TENSORS;

TRANSPORT PROPERTIES;

EID: 84866182038     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2012.6231481     Document Type: Conference Paper

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