Heat-removal performance scaling of interlayer cooled chip stacks

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Volumn , Issue , 2010, Pages

  Brunschwiler, T ^a   Paredes, S ^a   Drechsler, U ^a   Michel, B ^a   Cesar, W ^b   Leblebici, Y ^b   Wunderle, B ^c   Reichl, H ^c  

^a IBM RESEARCH ZURICH   (Switzerland)

^b EPFL   (Switzerland)

^c FRAUNHOFER IZM   (Germany)

Author keywords

3D chip stacks; Cross flow; Field coupling; Forced convective single phase heat transfer; Interlayer cooling; Microchannel; Multi scale modeling; Pin fin; Porous media; Vertically integrated packages

Indexed keywords

3D CHIP STACKS; CROSS FLOWS; CROSS-FLOW; FIELD-COUPLING; FORCED CONVECTIVE SINGLE-PHASE HEAT TRANSFER; MULTI-SCALE MODELING; PIN-FINS; POROUS-MEDIA;

ATMOSPHERIC TURBULENCE; COOLING; CUSTOMER SATISFACTION; ELECTRONICS ENGINEERING; FINS (HEAT EXCHANGE); FLUIDS; HEAT EXCHANGERS; HEAT FLUX; MICROCHANNELS; PARAMETER EXTRACTION; PHASE INTERFACES; THREE DIMENSIONAL;

CHIP SCALE PACKAGES;

EID: 77955224497     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2010.5501254     Document Type: Conference Paper

References (12)

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