Study of fluxless soldering using formic acid vapor

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 4, 1999, Pages 592-601

  Lin, Wei ^a   Lee, Y C ^b  

^a NOKIA RESEARCH CENTER   (United States)

^b UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD; SOLDERED JOINTS; TIN; VIBRATIONS (MECHANICAL);

FLUXLESS SOLDING PROCESS; FORMIC ACID VAPORS; SELF-ALIGNING PROCESS;

ELECTRONICS PACKAGING;

EID: 0033347724     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.803451     Document Type: Article

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