Fluxless bump reflow using carboxylic acid

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2001, Pages 135-139

  Matsuki, H ^a   Matsui, H ^a   Watanabe, E ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

Bump forming; Bump reflow; Carboxylic acid; Fluxless; Void

Indexed keywords

CARBOXYLIC ACIDS; EUTECTICS; FLIP CHIP DEVICES; FLUXES; SHEAR STRENGTH; SOLDERING ALLOYS; THERMODYNAMIC STABILITY;

BUMP REFLOW;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0034996144     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)