Direct liquid cooling of a stacked multichip module

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 380-384

  Chen, X Y ^a   Toh, K C ^a   Chai, J C ^a   Pinjala, D ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COOLING; ELECTRONICS PACKAGING; HEAT CONDUCTION; HEAT FLUX; HEAT TRANSFER; MICROPROCESSOR CHIPS; MULTICHIP MODULES;

CONJUGATED CONVECTION-CONDUCTION HEAT TRANSFERS; COOLING REQUIREMENTS; COOLING STRUCTURES; ELECTRONIC COMPONENT; FUTURE GENERATIONS; MICRO-FABRICATION TECHNIQUES; SINGLE-PHASE LIQUIDS; THREE-DIMENSIONAL NUMERICAL SIMULATIONS;

ELECTRONIC COOLING;

EID: 84964671846     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2002.1185702     Document Type: Conference Paper

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