Role of grain orientation in the failure of Sn-based solder joints under thermomechanical fatigue

Acta Metallurgica Sinica (English Letters)

Volumn 25, Issue 3, 2012, Pages 214-224

  Han, Jing ^a   Chen, Hongtao ^a   Li, Mingyu ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Anisotropy; Grain orientation; Pb free solder; Recrystallization; Thermomechanical fatigue

Indexed keywords

BGA PACKAGE; CROSS-POLARIZED; DAMAGE EVOLUTION; FATIGUE CRACKS; GRAIN ORIENTATION; HIGH ANGLE GRAIN BOUNDARIES; LATTICE STRUCTURES; ORIENTATION IMAGING MICROSCOPY; PACKAGE STRUCTURE; PB FREE SOLDERS; RECRYSTALLIZED GRAINS; SN GRAINS; SN-BASED SOLDERS; SN3.5AG SOLDER; SOLDER JOINTS; STRONG ANISOTROPY; THERMO MECHANICAL FATIGUES (TMF); THERMO-MECHANICAL;

ANISOTROPY; CRYSTALLIZATION; GRAIN BOUNDARY SLIDING; LEAD; MICROSTRUCTURE; OPTICAL MICROSCOPY; RECRYSTALLIZATION (METALLURGY); SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SOLDERING ALLOYS;

TIN;

EID: 84864440573     PISSN: 10067191     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (30)

1. P.T. Vianco, J.A. Rejent and A.C. Kilgo, J Electron Mater 32 (2003) 142
2. D.M. Pierce, S.D. Sheppard, A.F. Fossum, P.T. Vianco and M.K. Neilsen, J Electron Packaging 130 (2008) 1
3. M.A. Matin, W.P. Vellinga and M.G.D. Geers, Mater Sci Eng 445 (2007) 73
4. T.T. Mattila, V. Vuorinen and J.K. Kivilahti, J Mater Res 19 (2004) 3214
5. T.T. Mattila and J.K. Kivilahti, J Electron Mater 34 (2005) 969
6. T. Laurila, T. Mattila, V. Vuorinen, J. Karppinen, J. Li, M. Sippola and J.K. Kivilahti, Microelectron Reliab 47 (2007) 1135
7. J. Karppinen, T. Laurila and J.K. Kivilahti, Electronics Systemintegration Technology Conference (IEEE, Dresden, Germany, 2006) p.187
8. A.U. Telang, T.R. Bieler, A. Zamiri and F. Pourboghrat, Acta Mater 55 (2007) 2265
9. T. Marje, K. Korhonen, L.P. Lehman, M.A. Korhonen and D.W. Henderson, J Electron Mater 36 (2007) 173
10. A. Mayyas, L. Yin and P. Borgesen, International Mechanical Engineering Congress & Exposition (ASME, Lake Buena Vista, Florida, USA, 2009) p.1
11. T.T. Mattila and J.K. Kivilahti, IEEE Trans Compd Packaging Technol 33 (2010) 629
12. M.A. Matin, E.W.C. Coenen, W.P. Vellinga and M.G.D. Geers, Scr Mater 53 (2005) 927
13. S. Dunford, S. Canumalla and P. Viswanadham, Electronic Components and Technology Conference (IEEE, USA, 2004) p.726
14. L.P. Lehman, R.K. Kinyanjui, J. Wang, Y. Xing, L. Zavalij, P. Borgesen and E.J. Cotts, Electronic Components and Technology Conference (IEEE, Lake Buena Vista, FL, USA, 2005) p.674
15. T.R. Bieler, H. Jiang, L.P. Lehman, T. Kirkpatrick and E.J. Cotts, Electronic Components and Tech- nology Conference (IEEE, San Diego, FL, USA, 2006) p.370
16. C. Zhang, J.K. Lin and L. Li, Electronic Components and Technology Conference (IEEE, Orlando, FL, USA, 2001) p.463
17. H.T. Chen, M. Mueller, T.T. Mattila, J. Li, X.W. Liu, K.J. Wolter and M. Paulasto, J Mater Res 26 (2011) 2103
18. H.T. Chen, J. Han and M.Y. Li, J Electron Mater 40 (2011) 2470
19. H.T. Chen, L. Wang, J. Han, M.Y. Li and Q.B. Wu, J Electron Mater 40 (2011) 2445
20. S.B. Park, R. Dhakal, L. Lehman and E. Cotts, Acta Mater 55 (2007) 3253
21. S.B. Park, R. Dhakal, L. Lehman and E.J. Cotts, IEEE Trans Compon Packaging Technol 30 (2007) 178
22. M. Erinc, P.J.G. Schreurs and M.G.D. Geers, Mech Mater 40 (2008) 780
23. J.G. Lee and K.N. Subramanian, Microelectron Reliab 47 (2007) 118
24. S. Choi, J.G. Lee, K.N. Subramanian, J.P. Lucas and T.R. Bieler, J Electron Mater 31 (2002) 292
25. S. Terashima, M. Tanaka and K. Tatsumi, Sci Technol Weld Join 13 (2008) 60
26. J. Villain, U. Corradi, C.Weippert, S. Klima, M. Meeh and S. Golling, Electronics Packaging Technology Conference (IEEE, Singapore, 2007) p.356
27. X.W. Liu and W.J. Plumbridge, J Electron Mater 36 (2007) 1111
28. M. Berthou, P. Retailleau, H. Frflemont, A.G. Gracia and C.J. Davennel, Microelectron Reliab 49 (2009) 1267
29. S.K. Seo, M.G. Cho and H.M. Lee, Mater Res Soc 25 (2010) 1950
30. S. Terashima, T. Kohno, A. Mizusawa, K. Arai, O. Okada, T.Wakabayashi, M. Tanaka and K. Tatsumi, J Electron Mater 38 (2009) 33