Post porosity plasma protection: Scaling of efficiency with porosity

Advanced Functional Materials

Volumn 22, Issue 14, 2012, Pages 3043-3050

  Frot, Theo ^a   Volksen, Willi ^a   Purushothaman, Sampath ^b   Bruce, Robert L ^b   Magbitang, Teddie ^a   Miller, Dolores C ^a   Deline, Vaughn R ^a   Dubois, Geraud ^a  

^a IBM ALMADEN RESEARCH CENTER   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

composite materials; dielectrics; electronic processes; electronic structures; porous materials; thin films

Indexed keywords

BLANKET WAFERS; ELECTRONIC PROCESS; EXPONENTIAL INCREASE; FUTURE TECHNOLOGIES; IN-PROCESS; LOWER-POWER CONSUMPTION; MATERIALS AND PROCESS; MESOPOROUS; MICROPOROUS; PATTERNED STRUCTURE; PLASMA DAMAGE; SIGNAL DELAYS; ULTRA-LOW DIELECTRIC CONSTANT;

COMPOSITE MATERIALS; ELECTRONIC STRUCTURE; MESOPOROUS MATERIALS; MICROPOROSITY; POROUS MATERIALS; THIN FILMS;

DIELECTRIC MATERIALS;

EID: 84863912713     PISSN: 1616301X     EISSN: 16163028     Source Type: Journal    
DOI: 10.1002/adfm.201200152     Document Type: Article

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