Patterning of porous SiOCH using an organic mask: Comparison with a metallic masking strategy

Journal of Vacuum Science and Technology B

Volumn 28, Issue 1, 2010, Pages 149-156

  Darnon, M ^a   Chevolleau, T ^a   David, T ^a,b   Ducote, J ^a   Posseme, N ^a   Bouyssou, R ^a   Bailly, F ^b   Perret, D ^c   Joubert, O ^a  

^a CEA GRENOBLE   (France)

^b STMICROELECTRONICS   (France)

^c MINATEC   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIREFLECTION COATINGS; DIELECTRIC MATERIALS; ECONOMIC AND SOCIAL EFFECTS; ORGANIC CARBON; PASSIVATION; POROUS SILICON; SILICON COMPOUNDS;

ANTI REFLECTIVE COATINGS; CARBON-BASED; COATING LAYER; DIELECTRIC LAYER; ETCHING PROCESS; FLUOROCARBON-BASED PLASMA; METALLICS; ORGANICS; POROUS DIELECTRICS; SUB-100 NM;

ETCHING;

EID: 77949395281     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.3276703     Document Type: Conference Paper

References (19)

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