Design and fabrication of microelectromechanical systems probe card with vertical trench guide for fine pitch probing

Japanese Journal of Applied Physics

Volumn 51, Issue 6 PART 2, 2012, Pages

  Kim, Bonghwan ^a   Cho, Chanseob ^a,b   Lee, Byeungleul ^a,c   Kim, Hyeon Cheol ^a,d   Chun, Kukjin ^a,e  

^a Catholic University of Daegu   (South Korea)

^b Kyungpook National University   (South Korea)

^c Korea University of Technology and Education   (South Korea)

^d University of Ulsan   (South Korea)

^e Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

APPLIED FORCES; BURN-IN TESTING; COMPLIANT STRUCTURES; FINE PITCH; IC TESTING; MEMS PROBE CARD; NEEDLE PROBES; PLANARITY; PROBE CARDS; RF DEVICES; WAFER LEVEL;

MECHATRONICS; MICROELECTROMECHANICAL DEVICES; MICROMECHANICS;

MEMS;

EID: 84863328512     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.51.06FL16     Document Type: Article

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