A novel MEMS probe for LSI testing

2007 International Symposium on Micro-NanoMechatronics and Human Science, MHS

Volumn , Issue , 2007, Pages 454-459

  Kimura, Teppei ^a   Tajima, Syohei ^a   Sakamoto, Tetsuhisa ^a   Tsuboi, Mitsuaki ^a   Ishida, Tomohiro ^a   Hattori, Tadashi ^b  

^a JEM Finetech Corporation   (Japan)

^b UNIVERSITY OF HYOGO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT RESISTANCE; ELECTRIC PROPERTIES; ELECTROFORMING; ELECTRON DEVICE TESTING; FORMING; LITHOGRAPHY; LSI CIRCUITS; MANGANESE COMPOUNDS; MECHANICAL PROPERTIES; MICROELECTROMECHANICAL DEVICES;

3-DIMENSIONAL; CONTACT FORCES; ELECTRICAL PROPERTIES; HIGH POTENTIAL; HUMAN SCIENCES; IC CHIPS; INTERNATIONAL SYMPOSIUM; LSI CHIPS; LSI TESTING; MICRO PROBES; NANOMECHATRONICS; PROBE CARDS;

SOCIAL SCIENCES;

EID: 50149095585     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MHS.2007.4420898     Document Type: Conference Paper

References (5)

1. Y. Itoh: "MEMS Sealing and MEMS Probe cards", Japan Institute of Electronics Packaging, Vol.8, No.1 pp.33-36 (2005) (in Japanese)
2. th Microelectronics Symposium (MES)., pp.103-106 (2002) (in Japanese)
3. T. Kimura, T. Ishida, T. Hattori, "Development of 3-Dimentional Micro Probe using X-Ray Lithography and High-Strength Electroformed Ni", Proc of International Symposium on Micro-NanoMechatronics and Human Science (CD-ROM), pp.503-508 (2006)
4. th Symposium On Micro joining and Assembly Technology in Electronics, pp.97-100 (2007) (in Japanese)
5. th Symposium On Micro joining and Assembly Technology in Electronics, pp427-430, (2006) (in Japanese)