Ultra long needle geometry probe card development for wafer level test

2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008

Volumn , Issue , 2008, Pages 78-81

  Chang, Hao Yuan ^a,b   Pan, Wen Fung ^b   Shih, Meng Kai ^a   Lai, Yi Shao ^a   Tsao, Yu Cheng ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL PROBING; DESIGN PARAMETERS; DEVICE TESTING; DIGITAL LIGHT PROCESSING; EXPERIMENTAL AND NUMERICAL METHODS; MEMS DEVICES; NUMERICAL INVESTIGATIONS; PERFORMANCE EVALUATIONS; PROBE CARDS; PROBE GEOMETRIES; PROBING TECHNIQUES; SIMULATION MODELS; STRESS DISTRIBUTIONS; WAFER LEVEL TESTS; WAFER PROBING; WAFER SORTING; WAFER TESTING; WAFER-LEVEL TESTING;

CHIP SCALE PACKAGES; MEMS; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; NEEDLES; NUMERICAL METHODS; PROBES; STRESS CONCENTRATION; THREE DIMENSIONAL;

COMPUTATIONAL GEOMETRY;

EID: 64049115100     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2008.4783812     Document Type: Conference Paper

References (19)

1. J. Sampsell, "An overview of the digital micromirror device (DMD) and its application to projection displays," in 1993 SID International Symposium Digest of Technical Papers, vol. 24, p. 1012, 1993.
2. L.J. Hornbeck, "Digital Light Processing and MEMS: Timely Convergence for a Bright Future", Plenary Session, SPIE Mcromachining and Microfabrication '95, Austin, Texas (October 24, 1995). Color reprint available from Texas Instruments Digital Imaging Group.
3. A. Sontheimer, "Digital Mcromirror Device (DMD) Hinge Memory Lifetime Reliability Modeling," Proceedings of International Reliability Physics Symposium, 2002, pp. 118-121.
4. M. Douglass, "DMD Reliability: A MEMS Success Story ", SPIE Proceedings, Vol. 4980, 2003.
5. Digital Light Processing World Wide Wed Site: http: //www, ti. com/dip 15
6. Xia Lou; Zhihong Li; Yufeng Jin; "Plastic-Silicon Bonding for MEMS Packaging Application"; Proceedings of 7th International Conference on Electronics Packaging Technology, ICEPT2006, 26-29 Aug,2006,pp524-526
7. S. Maekawa, M. Takemoto, Y. Kashiba, Y. Deguchi, K. Miki, T. Nagata, Highly reliable probe card for wafer testing, Presented at the 50th International Conference IEEE Electronic Components and Technology Conference, 2000, pp. 1152-1156.
8. M. J. Varnau, "Impact of wafer probe damage on flip chip yields and reliability," in Proc. IEEE/CPMT-IEMT, 1996, pp. 293-297.
9. Hotchkiss, G., Ryan, G., Subido, W., Broz, J., Mitchell, S.,Rincon, R., Roida, R. and Guimbaolibot, L., "Effect of Probe Damage on Wire Bond Integrity," IEEE Electronic Components and Technology Conference, 2001.
10. Q.Tan, C.Beddingfield, and A. Mistry,"Reliability evaluation of probe-before-bump technology," in Proc. IEEE/CPMT-IEMT, 1999,pp. 320-324.
11. D.T.Read and J. W. Dally, "Mechanical behavior of aluminum and copper thin films," in Proc. ASME-IMECE, 1994, pp. 41-49.
12. D.S.Liu ,M.K. Shih, An Experimental and Numerical Investigation Into Multilayer Probe Card Layout Design, in Proc. IEEE/CPMTEPM, 2006, pp. 163-171.
13. D.S.Liu , M.K. Shih, Experimental method and FE simulation model for evaluation of wafer probing parameters, in Proc. Microelectronics Journal, 2006, pp. 871-883.
14. J.J.Broz, R.M. Rincon, Probe contact resistance variationsduring elevated temperature wafer test, IEEE Itc International Test Conference, 1999, pp. 396-405.
15. L.Tran and R.Rincon, "Why using finite element analyses to optimize cantilever probe card design," IEEE South West Test Workshop, 2005
16. J. Storm, "A study of probing process," IEEE South West Test Workshop, 1999
17. Probe Card Analyzer Workstation WIN32 User Manual, Integrated Technology Corporation, 2002.
18. Weeden, O.," Probe Card Tutorial, "(keithley), in http://www, keithley .com
19. D.T. Read, JW. Dally, Mechanical Behavior of Aluminum and Copper Thin Films, American Society of Mechanical Engineers, Applied Mechanics Division, AMD, Mechanics and Materials for Electronic Packaging, 1994, pp. 41-49.