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Volumn , Issue , 2002, Pages 424-429

Low contact force probing on copper electrodes

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; ELECTRIC BREAKDOWN; ELECTRIC RESISTANCE MEASUREMENT; ELECTRODES; FORCE MEASUREMENT; MICROELECTROMECHANICAL DEVICES; PROBES;

EID: 0036443087     PISSN: 10893539     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (17)

References (11)
  • 3
    • 0033099665 scopus 로고    scopus 로고
    • Thermally actuated microprobes for a new wafer probe card
    • Y. Zhang, Y. Zhang, and R. B. Marcus, "Thermally actuated microprobes for a new wafer probe card," IEEE J. Microelectromechanical Systems, vol. 8, no. 1, pp. 43-49, 1999
    • (1999) IEEE J. Microelectromechanical Systems , vol.8 , Issue.1 , pp. 43-49
    • Zhang, Y.1    Zhang, Y.2    Marcus, R.B.3
  • 9
    • 0009776026 scopus 로고    scopus 로고
    • Characteristics of fritting contacts utilized for micromachined wafer probe cards
    • T. Itoh, T. Suga, G. Engelmann, J. Wolf, O. Ehrmann, and H. Reichl, "Characteristics of fritting contacts utilized for micromachined wafer probe cards," Rev. Sci. Instrum., vol. 71, no. 5, pp. 1-4, 2000.
    • (2000) Rev. Sci. Instrum. , vol.71 , Issue.5 , pp. 1-4
    • Itoh, T.1    Suga, T.2    Engelmann, G.3    Wolf, J.4    Ehrmann, O.5    Reichl, H.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.