High density vertical probe card fabrication with low cost and high precision characteristics by using MEMS process

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 1, Issue , 2005, Pages 107-112

  Huang, Jung Tang ^a   Lin, Chung Yi ^a   Lai, Wen Shiung ^a   Chao, Pen Shan ^a   Shih, Sheng Hsiung ^a  

^a NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COMPUTER SOFTWARE; ELASTIC MODULI; ELECTROPLATING; FINITE ELEMENT METHOD; MICROELECTROMECHANICAL DEVICES;

CHEMICAL MECHANICAL POLISHING (CMP); MEMS PROBE CARD;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 33847294325     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

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