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Applied Surface Science

Volumn 258, Issue 20, 2012, Pages 7962-7967

Effect of composition on electroless deposited Ni-Co-P alloy thin films as a diffusion barrier for copper metallization

(3) Kumar, Anuj a,b Kumar, Mukesh b Kumar, Dinesh b

a INDIAN INSTITUTE OF TECHNOLOGY DELHI (India)

b KURUKSHETRA UNIVERSITY (India)

Author keywords

Copper; Diffusion barrier; Electroless; Ni Co P

Indexed keywords

COPPER; DIFFUSION BARRIERS; INTEGRATED CIRCUIT INTERCONNECTS; METALLIC FILMS; NICKEL ALLOYS; SCANNING ELECTRON MICROSCOPY; THERMODYNAMIC STABILITY; THIN FILMS;

COPPER INTERCONNECTS; COPPER METALLIZATION; ELECTROLESS; ELECTROLESS TECHNIQUE; ELEVATED TEMPERATURE; FIELD EMISSION SCANNING ELECTRON MICROSCOPES; SILICON SUBSTRATES; X RAY DIFFRACTOMETERS;

COBALT ALLOYS;

EID: 84862569156 PISSN: 01694332 EISSN: None Source Type: Journal
DOI: 10.1016/j.apsusc.2012.04.145 Document Type: Article

Times cited : (20)

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