Crystallization behavior of Ni-P alloy films on Co and Cu seed layers

Journal of the Electrochemical Society

Volumn 152, Issue 9, 2005, Pages

  Antonelli, S B ^a   Allen, T L ^a   Johnson, D C ^a   Dubin, V M ^b  

^a UNIVERSITY OF OREGON   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COBALT; COPPER; CRYSTALLIZATION; ELECTROLESS PLATING; SECONDARY ION MASS SPECTROMETRY; TEMPERATURE DISTRIBUTION; THIN FILMS;

ATOMIC LEVEL MODEL; CRYSTALLIZATION BEHAVIORS; SEED LAYERS;

NICKEL ALLOYS;

EID: 25644432676     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1997175     Document Type: Article

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