Diffusion barrier properties of TaC between Si and Cu

Thin Solid Films

Volumn 301, Issue 1-2, 1997, Pages 142-148

  Imahori, Junji ^a   Oku, Takeo ^a   Murakami, Masanori ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Copper; Diffusion; Interfaces; Silicon

Indexed keywords

COPPER; CRYSTAL MICROSTRUCTURE; DIFFUSION IN SOLIDS; ELECTRON MICROSCOPY; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); SILICON; X RAY DIFFRACTION ANALYSIS;

DIFFUSION BARRIER LAYERS;

TANTALUM CARBIDE;

EID: 0031152731     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(97)00057-6     Document Type: Article

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