Integrated electroless metallization for ULSI

Electrochimica Acta

Volumn 44, Issue 21, 1999, Pages 3639-3649

  Shacham Diamand, Yosi ^a   Lopatin, Sergey ^b  

^a TEL AVIV UNIVERSITY   (Israel)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROLESS PLATING; MICROELECTRONIC PROCESSING; REDOX REACTIONS; SILICON WAFERS; SURFACE PHENOMENA; ULSI CIRCUITS;

COPPER INTERCONNECT; ELECTROCHEMICAL OXIDATION REDUCTION REACTION; INLAID COPPER TECHNOLOGY;

METALLIZING;

EID: 0032660473     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-4686(99)00067-5     Document Type: Article

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